| NAME |
Description |
Potential Uses |
| 3-6605 |
Two-part (1:1) mix, gray, medium viscosity |
Bonding integrated circuit suvstrates, adhering lids and housings, base plate attach, heat sink attach |
| 3-6642 |
Two-part (1:1 to 5:1), low viscosity, excellent flow, gray, can increase amount of part A for softer elastomer |
Potting/encapsulating electronic modules, power supplies, transformers, coils, relays, etc. where heat dissipation is needed |
| 1-4173 |
One-part, low flow, gray |
Bonding integrated circuit substrates, adhering lids and housings, base plate attach, heat sink attach |
| 1-4174 |
One-part, low flow, gray |
Glob top |
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